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상세 정보 |
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| 인버터 브랜드: | 슈나이더 | 포장: | 표준 나무 케이스 |
|---|---|---|---|
| 먹이는 방법: | 하단, 측면 선택 가능 | 작업 스테이션: | 24 |
| 최대 제품 너비: | 500mm | 버전: | 2.0 |
| 차원: | 고객 요구 사항 | 주파수 브랜드: | 실린 또는 슈나이더 |
제품 설명
24-Station Spin Coater Barrier Coating | Edge Bead Reduction & Anti-Contamination for Semiconductor Lines
This 24-station spin coater barrier coating is formulated to form a sacrificial or permanent isolation layer on substrates before main coating (photoresist, polyimide, or dielectric). It prevents cross-contamination, reduces edge bead formation, and protects spin chucks from solvent attack. Customizable solid content, solvent system, and stripping method available for different wafer sizes (2″-12″) and device layers.
Technical Parameters
| Parameter | Value / Range |
|---|---|
| Solid Content | 2% - 25% (customizable) |
| Viscosity (cP @25°C) | 3 - 150 (adjustable) |
| Density (g/cm³) | 0.85 - 1.10 |
| Spin speed range | 500 - 6000 rpm (24 stations synchronized) |
| Film thickness (after spin) | 0.1 - 5.0 μm (tunable) |
| Drying temperature | 80 - 200°C (hotplate or oven) |
| Drying time | 30 - 180 sec |
| Metal ion content (Na, K, Fe) | < 10 ppb each (high-purity grade) |
| Particle count (≥0.2 μm) | < 30 / mL |
| Stripping method | Solvent strip (NMP, PGMEA) or thermal decomposition |
Applications
- Semiconductor wafer processing (front-end & back-end)
- MEMS & sensor manufacturing
- Compound semiconductor (GaN, SiC) spin coating
- LED phosphor & protective layer
- R & D spin coaters with 24-position capability
- Custom substrates (glass, sapphire, metal, polymer films)
Customization
We offer full customization for 24-station spin coaters:
- Solvent system (PGMEA, cyclohexanone, anisole, water-based)
- Stripping method (wet strip, ashing, or leave-on permanent)
- Edge bead reduction effect (customizable receding contact angle)
- Wafer size compatibility (2", 4", 6", 8", 12")
- Batch volume from 500mL (R&D) to 20L (production)
- Low-metal & low-particle grades available per customer spec
Features
- ✅ Prevents resist contamination on spin chuck and cover cup
- ✅ Reduces edge bead height by 60-80%
- ✅ Compatible with automated dispensing & EBR systems
- ✅ No post-coating residue after proper stripping
- ✅ Heat-stable up to 200°C (no outgassing)
- ✅ Low defect density (<0.05 defects/cm²)
- ✅ Can be used as sacrificial layer for lift-off processes
Support and Services
- Process optimization for your 24-station spin coater (speed/acceleration/ramping)
- Free residue test on your wafer type
- On-site or remote installation support
- Custom formula development within 15 working days
- Material safety datasheet (SDS) + processing guide
- 24/7 technical support for production lines
Packing and Shipping
- Standard packing: 1L, 4L, 20L HDPE bottles (double-bagged)
- Custom packing: 200L drum, 1000L IBC, or sealed syringe cartridges for automated dispensing
- Shipping: Cleanroom-packed, Class 3 flammable (if solvent-based) or non-dangerous (water-based)
- Lead time: 5 days for stock, 12-18 days for custom batches
- Storage: 6-12 months @15-25°C in original sealed container
Frequently Asked Questions
Q1: Can this barrier coating be used on all 24-station spin coaters?
A: Yes. The fluid is customizable for different nozzle types (static, linear scan, or spray) and spin chuck designs (vacuum or mechanical). Provide your coater model for optimization.
Q2: Is it permanent or removable?
A: Both. Standard version is strippable (solvent or ash). Permanent version available for protective layer applications.
Q3: Will it affect photoresist adhesion?
A: No. The barrier coating is designed to be either fully removed or to have matched surface energy. Adhesion tests can be provided.
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